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74HC244; 74HCT244
Octal buffer/line driver; 3-state
Rev. 03 -- 22 December 2005 Product data sheet
1. General description
The 74HC244; 74HCT244 is a high-speed Si-gate CMOS device and is pin compatible with Low-power Schottky TTL (LSTTL). The 74HC244; 74HCT244 has octal non-inverting buffer/line drivers with 3-state outputs. The 3-state outputs are controlled by the output enable inputs 1OE and 2OE. A HIGH on nOE causes the outputs to assume a high-impedance OFF-state. The 74HC244; 74HCT244 is identical to the 74HC240; 74HCT240 but has non-inverting outputs.
2. Features
s s s s Octal bus interface Non-inverting 3-state outputs Complies with JEDEC standard no. 7A ESD protection: x HBM EIA/JESD22-A114-C exceeds 2000 V x MM EIA/JESD22-A115-A exceeds 200 V s Multiple package options s Specified from -40 C to +85 C and from -40 C to +125 C
3. Quick reference data
Table 1: Quick reference data GND = 0 V; Tamb = 25 C; tr = tf = 6 ns Symbol Parameter 74HC244 tPHL, tPLH Ci CPD propagation delay nAn to nYn input capacitance power dissipation capacitance propagation delay nAn to nYn input capacitance power dissipation capacitance per buffer; VI = GND to (VCC - 1.5 V)
[1]
Conditions VCC = 5 V; CL = 15 pF
Min -
Typ 9 3.5 35
Max -
Unit ns pF pF
per buffer; VI = GND to VCC VCC = 5 V; CL = 15 pF
[1]
-
74HCT244 tPHL, tPLH Ci CPD
[1]
-
11 3.5 35
-
ns pF pF
CPD is used to determine the dynamic power dissipation (PD in W): PD = CPD x VCC2 x fi x N + (CL x VCC2 x fo) where:
Philips Semiconductors
74HC244; 74HCT244
Octal buffer/line driver; 3-state
fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; (CL x VCC2 x fo) = sum of outputs.
4. Ordering information
Table 2: Ordering information Package Temperature range Name 74HC244 74HC244N 74HC244D 74HC244DB 74HC244PW 74HC244BQ -40 C to +125 C -40 C to +125 C -40 C to +125 C -40 C to +125 C -40 C to +125 C DIP20 SO20 SSOP20 TSSOP20 plastic dual in-line package; 20 leads (300 mil) plastic small outline package; 20 leads; body width 7.5 mm plastic shrink small outline package; 20 leads; body width 5.3 mm plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT146-1 SOT163-1 SOT339-1 SOT360-1 SOT764-1 Description Version Type number
DHVQFN20 plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 20 terminals; body 2.5 x 4.5 x 0.85 mm DIP20 SO20 SSOP20 TSSOP20 plastic dual in-line package; 20 leads (300 mil) plastic small outline package; 20 leads; body width 7.5 mm plastic shrink small outline package; 20 leads; body width 5.3 mm plastic thin shrink small outline package; 20 leads; body width 4.4 mm
74HCT244 74HCT244N 74HCT244D -40 C to +125 C -40 C to +125 C SOT146-1 SOT163-1 SOT339-1 SOT360-1 SOT764-1
74HCT244DB -40 C to +125 C 74HCT244PW -40 C to +125 C 74HCT244BQ -40 C to +125 C
DHVQFN20 plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 20 terminals; body 2.5 x 4.5 x 0.85 mm
74HC_HCT244_3
(c) Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 -- 22 December 2005
2 of 22
Philips Semiconductors
74HC244; 74HCT244
Octal buffer/line driver; 3-state
5. Functional diagram
2
1A0
1Y0
18
4
1A1
1Y1
16
6
1A2
1Y2
14
8 1
1A3 1OE
1Y3
12
17
2A0
2Y0
3
15
2A1
2Y1
5
13
2A2
2Y2
7
11 19
2A3 2OE
2Y3
9
mna875
Fig 1. Functional diagram
1
EN 18 16 14 12
1A0
2
18
1Y0
2A0
17
3
2Y0
2 4
1A1
4
16
1Y1
2A1
15
5
2Y1
6 8
1A2
6
14
1Y2
2A2
13
7
2Y2 19 EN 9 7 5 3
mna873
1A3 1OE
8 1
12
1Y3
2A3 2OE
11 19
9
2Y3 11 13
mna874
15 17
Fig 2. Logic symbol
Fig 3. IEC logic symbol
74HC_HCT244_3
(c) Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 -- 22 December 2005
3 of 22
Philips Semiconductors
74HC244; 74HCT244
Octal buffer/line driver; 3-state
6. Pinning information
6.1 Pinning
74HC244 74HCT244
1OE 2 3 4 5 6 7 8 9 GND 10 2A3 11 GND (1) 1 terminal 1 index area 20 VCC 19 2OE 18 1Y0 17 2A0 16 1Y1 15 2A1 14 1Y2 13 2A2 12 1Y3
74HC244 74HCT244
1OE 1A0 2Y0 1A1 2Y1 1A2 2Y2 1A3 2Y3 1 2 3 4 5 6 7 8 9 20 VCC 19 2OE 18 1Y0 17 2A0 16 1Y1 15 2A1 14 1Y2 13 2A2 12 1Y3 11 2A3
001aae011
1A0 2Y0 1A1 2Y1 1A2 2Y2 1A3 2Y3
GND 10
001aae012
Transparent top view
(1) The die substrate is attached to this pad using conductive die attach material. It can not be used as supply pin or input
Fig 4. Pin configuration DIP20, SO20, SSOP20 and TSSOP20
Fig 5. Pin configuration DHVQFN20
6.2 Pin description
Table 3: Symbol 1OE 1A0 2Y0 1A1 2Y1 1A2 2Y2 1A3 2Y3 GND 2A3 1Y3 2A2 1Y2
74HC_HCT244_3
Pin description Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Description 1 output enable input (active LOW) 1 data input 0 2 bus output 0 1 data input 1 2 bus output 1 1 data input 2 2 bus output 2 1 data input 3 2 bus output 3 ground (0 V) 2 data input 3 1 bus output 3 2 data input 2 1 bus output 2
(c) Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 -- 22 December 2005
4 of 22
Philips Semiconductors
74HC244; 74HCT244
Octal buffer/line driver; 3-state
Pin description ...continued Pin 15 16 17 18 19 20 Description 2 data input 1 1 bus output 1 2 data input 0 1 bus output 0 2 output enable input (active LOW) supply voltage
Table 3: Symbol 2A1 1Y1 2A0 1Y0 2OE VCC
7. Functional description
7.1 Function table
Table 4: Control nOE L H
[1] H = HIGH voltage level; L = LOW voltage level; X = don't care; Z = high-impedance OFF-state.
Function table [1] Input nAn L H X Output nYn L H Z
8. Limiting values
Table 5: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol VCC IIK IOK IO ICC IGND Tstg Ptot Parameter supply voltage input clamping current output clamping current output current quiescent supply current ground current storage temperature total power dissipation DIP20 package SO20 package SSOP20 package TSSOP20 package DHVQFN20 package
[1] [2] [3] [3] [4]
Conditions VI < -0.5 V or VI > VCC + 0.5 V VO < -0.5 V or VO > VCC + 0.5 V VO = -0.5 V to (VCC + 0.5 V)
Min -0.5 -65 -
Max +7 20 20 35 70 -70 +150 750 500 500 500 500
Unit V mA mA mA mA mA C mW mW mW mW mW
74HC_HCT244_3
(c) Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 -- 22 December 2005
5 of 22
Philips Semiconductors
74HC244; 74HCT244
Octal buffer/line driver; 3-state
[1] [2] [3] [4]
For DIP20 package: Ptot derates linearly with 12 mW/K above 70 C. For SO20 package: Ptot derates linearly with 8 mW/K above 70 C. For SSOP20 and TSSOP20 packages: Ptot derates linearly with 5.5 mW/K above 60 C For DHVQFN20 packages: Ptot derates linearly with 4.5 mW/K above 60 C.
9. Recommended operating conditions
Table 6: Symbol 74HC244 VCC VI VO Tamb tr, tf supply voltage input voltage output voltage ambient temperature input rise and fall time VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V 74HCT244 VCC VI VO Tamb tr, tf supply voltage input voltage output voltage ambient temperature input rise and fall time VCC = 4.5 V 4.5 0 0 -40 5.0 25 6.0 5.5 VCC VCC +125 500 V V V C ns 2.0 0 0 -40 5.0 25 6.0 6.0 VCC VCC +125 1000 500 400 V V V C ns ns ns Recommended operating conditions Parameter Conditions Min Typ Max Unit
10. Static characteristics
Table 7: Static characteristics 74HC244 At recommended operating conditions; voltages are referenced to GND (ground = 0V). Symbol VIH Parameter HIGH-state input voltage Conditions VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V VIL LOW-state input voltage VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V VOH HIGH-state output voltage VI = VIH or VIL IO = -20 A; VCC = 2.0 V IO = -20 A; VCC = 4.5 V IO = -20 A; VCC = 6.0 V IO = -6.0 mA; VCC = 4.5 V IO = -7.8 mA; VCC = 6 V Min 1.5 3.15 4.2 1.9 4.4 5.9 3.98 5.48 Typ 1.2 2.4 3.2 0.8 2.1 2.8 2.0 4.5 6.0 4.32 5.81 Max 0.5 1.35 1.8 V V V V V Unit V V V V V V Tamb = 25 C
74HC_HCT244_3
(c) Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 -- 22 December 2005
6 of 22
Philips Semiconductors
74HC244; 74HCT244
Octal buffer/line driver; 3-state
Table 7: Static characteristics 74HC244 ...continued At recommended operating conditions; voltages are referenced to GND (ground = 0V). Symbol VOL Parameter LOW-state output voltage Conditions VI = VIH or VIL IO = 20 A; VCC = 2.0 V IO = 20 A; VCC = 4.5 V IO = 20 A; VCC = 6.0 V IO = 6.0 mA; VCC = 4.5 V IO = 7.8 mA; VCC = 6 V ILI IOZ ICC Ci VIH input leakage current OFF-state output current quiescent supply current input capacitance HIGH-state input voltage VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V VIL LOW-state input voltage VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V VOH HIGH-state output voltage VI = VIH or VIL IO = -20 A; VCC = 2.0 V IO = -20 A; VCC = 4.5 V IO = -20 A; VCC = 6.0 V IO = -6.0 mA; VCC = 4.5 V IO = -7.8 mA; VCC = 6 V VOL LOW-state output voltage VI = VIH or VIL IO = 20 A; VCC = 2.0 V IO = 20 A; VCC = 4.5 V IO = 20 A; VCC = 6.0 V IO = 6.0 mA; VCC = 4.5 V IO = 7.8 mA; VCC = 6 V ILI IOZ ICC input leakage current OFF-state output current quiescent supply current VI = VCC or GND; VCC = 6 V VI = VIH or VIL; VO = VCC or GND VI = VCC or GND; IO = 0 A; VCC = 6.0 V 0.1 0.1 0.1 0.33 0.33 1.0 5.0 80 V V V V V A A A 1.9 4.4 5.9 3.84 5.34 V V V V V VI = VCC or GND; VCC = 6 V VI = VIH or VIL; VO = VCC or GND VI = VCC or GND; IO = 0 A; VCC = 6.0 V 1.5 3.15 4.2 0 0 0 0.15 0.16 3.5 0.1 0.1 0.1 0.26 0.26 0.1 0.5 8.0 0.5 1.35 1.8 V V V V V A A A pF V V V V V V Min Typ Max Unit
Tamb = -40 C to +85 C
74HC_HCT244_3
(c) Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 -- 22 December 2005
7 of 22
Philips Semiconductors
74HC244; 74HCT244
Octal buffer/line driver; 3-state
Table 7: Static characteristics 74HC244 ...continued At recommended operating conditions; voltages are referenced to GND (ground = 0V). Symbol VIH Parameter HIGH-state input voltage Conditions VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V VIL LOW-state input voltage VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V VOH HIGH-state output voltage VI = VIH or VIL IO = -20 A; VCC = 2.0 V IO = -20 A; VCC = 4.5 V IO = -20 A; VCC = 6.0 V IO = -6.0 mA; VCC = 4.5 V IO = -7.8 mA; VCC = 6 V VOL LOW-state output voltage VI = VIH or VIL IO = 20 A; VCC = 2.0 V IO = 20 A; VCC = 4.5 V IO = 20 A; VCC = 6.0 V IO = 6.0 mA; VCC = 4.5 V IO = 7.8 mA; VCC = 6 V ILI IOZ ICC input leakage current OFF-state output current quiescent supply current VI = VCC or GND; VCC = 6 V VI = VIH or VIL; VO = VCC or GND VI = VCC or GND; IO = 0 A; VCC = 6.0 V 0.1 0.1 0.1 0.4 0.4 1.0 10.0 160 V V V V V A A A 1.9 4.4 5.9 3.7 5.2 V V V V V Min 1.5 3.15 4.2 Typ Max 0.5 1.35 1.8 Unit V V V V V V Tamb = -40 C to +125 C
Table 8: Static characteristics 74HCT244 At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol VIH VIL VOH Parameter HIGH-state input voltage LOW-state input voltage HIGH-state output voltage Conditions VCC = 4.5 V to 5.5 V VCC = 4.5 V to 5.5 V VI = VIH or VIL; VCC = 4.5 V IO = -20 A IO = -6.0 mA VOL LOW-state output voltage VI = VIH or VIL; VCC = 4.5 V IO = 20 A IO = 6.0 mA ILI IOZ input leakage current OFF-state output current VI = VCC or GND; VCC = 5.5 V per input pin; VI = VIH or VIL; VO = VCC or GND; other pins at GND or VCC; IO = 0 A; VCC = 5.5 V VI = VCC or GND; IO = 0 A; VCC = 5.5 V
Rev. 03 -- 22 December 2005
Min 2.0 4.4 3.98 -
Typ 1.6 1.2 4.5 4.32 0 0.16 -
Max 0.8 0.1 0.26 0.1 0.5
Unit V V V V V V A A
Tamb = 25 C
ICC
74HC_HCT244_3
quiescent supply current
-
-
8.0
A
(c) Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
8 of 22
Philips Semiconductors
74HC244; 74HCT244
Octal buffer/line driver; 3-state
Table 8: Static characteristics 74HCT244 ...continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol ICC Parameter additional quiescent supply current input capacitance HIGH-state input voltage LOW-state input voltage HIGH-state output voltage VCC = 4.5 V to 5.5 V VCC = 4.5 V to 5.5 V VI = VIH or VIL; VCC = 4.5 V IO = -20 A IO = -6.0 mA VOL LOW-state output voltage VI = VIH or VIL; VCC = 4.5 V IO = 20 A IO = 6.0 mA ILI IOZ input leakage current OFF-state output current VI = VCC or GND; VCC = 5.5 V per input pin; VI = VIH or VIL; VO = VCC or GND; other pins at GND or VCC; IO = 0 A; VCC = 5.5 V VI = VCC or GND; IO = 0 A; VCC = 5.5 V per input pin; VI = VCC - 2.1 V; other inputs at VCC or GND; IO = 0 A; VCC = 4.5 V to 5.5 V VCC = 4.5 V to 5.5 V VCC = 4.5 V to 5.5 V VI = VIH or VIL; VCC = 4.5 V IO = -20 A IO = -6.0 mA VOL LOW-state output voltage VI = VIH or VIL; VCC = 4.5 V IO = 20 A IO = 6.0 mA ILI IOZ input leakage current OFF-state output current VI = VCC or GND; VCC = 5.5 V per input pin; VI = VIH or VIL; VO = VCC or GND; other pins at GND or VCC; IO = 0 A; VCC = 5.5 V VI = VCC or GND; IO = 0 A; VCC = 5.5 V per input pin; VI = VCC - 2.1 V; other inputs at VCC or GND; IO = 0 A; VCC = 4.5 V to 5.5 V 0.1 0.4 1.0 10.0 V V A A 4.4 3.7 V V 0.1 0.33 1.0 5.0 V V A A 4.4 3.84 V V Conditions per input pin; VI = VCC - 2.1 V; other inputs at VCC or GND; IO = 0 A; VCC = 4.5 V to 5.5 V 2.0 Min Typ 70 Max 252 Unit A
Ci VIH VIL VOH
3.5 -
0.8
pF V V
Tamb = -40 C to +85 C
ICC ICC
quiescent supply current additional quiescent supply current
80 315
A A
Tamb = -40 C to +125 C VIH VIL VOH HIGH-state input voltage LOW-state input voltage HIGH-state output voltage 2.0 0.8 V V
ICC ICC
quiescent supply current additional quiescent supply current
-
-
160 343
A A
74HC_HCT244_3
(c) Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 -- 22 December 2005
9 of 22
Philips Semiconductors
74HC244; 74HCT244
Octal buffer/line driver; 3-state
11. Dynamic characteristics
Table 9: Dynamic characteristics 74HC244 GND = 0 V; tr = tf = 6 ns; CL = 50 pF unless otherwise specified; for test circuit see Figure 8. Symbol Parameter Tamb = 25 C tPHL, tPLH propagation delay nAn to nYn see Figure 6 VCC = 2.0 V VCC = 4.5 V VCC = 5 V; CL = 15 pF VCC = 6.0 V tPZH, tPZL 3-state output enable time nOE to nYn see Figure 7 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V tPHZ, tPLZ 3-state output disable time nOE to nYn see Figure 7 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V tTHL, tTLH output transition time see Figure 6 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V CPD power dissipation capacitance VI = GND to VCC
[1]
Conditions
Min
Typ
Max
Unit
-
30 11 9 9 36 13 10 39 14 11 14 5 4 35
110 22 19 150 30 26 150 30 26 60 12 10 -
ns ns ns ns ns ns ns ns ns ns ns ns ns pF
Tamb = -40 C to +85 C tPHL, tPLH propagation delay nAn to nYn see Figure 6 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V tPZH, tPZL 3-state output enable time nOE to nYn see Figure 7 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V tPHZ, tPLZ 3-state output disable time nOE to nYn see Figure 7 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V tTHL, tTLH output transition time see Figure 6 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V 75 15 13 ns ns ns 190 38 33 ns ns ns 190 38 33 ns ns ns 145 28 24 ns ns ns
74HC_HCT244_3
(c) Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 -- 22 December 2005
10 of 22
Philips Semiconductors
74HC244; 74HCT244
Octal buffer/line driver; 3-state
Table 9: Dynamic characteristics 74HC244 ...continued GND = 0 V; tr = tf = 6 ns; CL = 50 pF unless otherwise specified; for test circuit see Figure 8. Symbol Parameter Tamb = -40 C to +125 C tPHL, tPLH propagation delay nAn to nYn see Figure 6 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V tPZH, tPZL 3-state output enable time nOE to nYn see Figure 7 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V tPHZ, tPLZ 3-state output disable time nOE to nYn see Figure 7 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V tTHL, tTLH output transition time see Figure 6 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V
[1] CPD is used to determine the dynamic power dissipation (PD in W): PD = CPD x VCC2 x fi x N + (CL x VCC2 x fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; (CL x VCC2 x fo) = sum of outputs.
Conditions
Min
Typ
Max
Unit
-
-
165 33 28 225 45 38 225 45 38 90 18 15
ns ns ns ns ns ns ns ns ns ns ns ns
Table 10: Dynamic characteristics type 74HCT244 GND = 0 V; tr = tf = 6 ns; CL = 50 pF unless otherwise specified; for test circuit see Figure 8. Symbol Parameter Tamb = 25 C tPHL, tPLH propagation delay nAn to nYn see Figure 6 VCC = 4.5 V VCC = 5 V; CL = 15 pF tPZH, tPZL tPHZ, tPLZ tTHL, tTLH CPD 3-state output enable time nOE to nYn 3-state output disable time nOE to nYn output transition time power dissipation capacitance VCC = 4.5 V; see Figure 7 VCC = 4.5 V; see Figure 7 VCC = 4.5 V; see Figure 6 VI = GND to (VCC - 1.5 V)
[1]
Conditions
Min
Typ
Max
Unit
-
13 11 15 15 5 35
22 30 25 12 -
ns ns ns ns ns pF
74HC_HCT244_3
(c) Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 -- 22 December 2005
11 of 22
Philips Semiconductors
74HC244; 74HCT244
Octal buffer/line driver; 3-state
Table 10: Dynamic characteristics type 74HCT244 ...continued GND = 0 V; tr = tf = 6 ns; CL = 50 pF unless otherwise specified; for test circuit see Figure 8. Symbol Parameter Tamb = -40 C to +85 C tPHL, tPLH tPZH, tPZL tPHZ, tPLZ tTHL, tTLH tPHL, tPLH tPZH, tPZL tPHZ, tPLZ tTHL, tTLH
[1]
Conditions
Min -
Typ -
Max 28 38 31 15
Unit ns ns ns ns
propagation delay nAn to nYn VCC = 4.5 V; see Figure 6 3-state output enable time nOE to nYn 3-state output disable time nOE to nYn output transition time VCC = 4.5 V; see Figure 7 VCC = 4.5 V; see Figure 7 VCC = 4.5 V; see Figure 6
Tamb = -40 C to +125 C propagation delay nAn to nYn VCC = 4.5 V; see Figure 6 3-state output enable time nOE to nYn 3-state output disable time nOE to nYn output transition time VCC = 4.5 V; see Figure 7 VCC = 4.5 V; see Figure 7 VCC = 4.5 V; see Figure 6 33 45 38 18 ns ns ns ns
CPD is used to determine the dynamic power dissipation (PD in W): PD = CPD x VCC2 x fi x N + (CL x VCC2 x fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; (CL x VCC2 x fo) = sum of outputs.
12. Waveforms
VI nAn input GND t PHL VOH nYn output VOL t THL 90 % VM 10 % t TLH
001aae013
VM
VM
t PLH
VM
Measurement points are given in Table 11. VOL and VOH are typical voltage output drop that occur with the output load.
Fig 6. Propagation delay input (1An, 2An) to output (1Yn, 2Yn) and transition time output (nYn)
74HC_HCT244_3
(c) Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 -- 22 December 2005
12 of 22
Philips Semiconductors
74HC244; 74HCT244
Octal buffer/line driver; 3-state
VI nOE input GND t PLZ VCC nYn output LOW-to-OFF OFF-to-LOW VOL t PHZ VOH nYn output HIGH-to-OFF OFF-to-HIGH GND outputs enabled outputs disabled outputs enabled
001aae014
VM
t PZL
VM VX t PZH VY VM
Measurement points are given in Table 11. VOL and VOH are typical voltage output drop that occur with the output load.
Fig 7. 3-state enable and disable times Table 11: Type 74HC244 74HCT244 Measurement points Input VM 0.5VCC 1.3 V Output VM 0.5VCC 1.3 V
74HC_HCT244_3
(c) Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 -- 22 December 2005
13 of 22
Philips Semiconductors
74HC244; 74HCT244
Octal buffer/line driver; 3-state
VI negative pulse 0V
tW 90 % VM 10 % tf tr tr tf 90 % VM 10 % tW VM VM
VI positive pulse 0V
VCC
VCC
PULSE GENERATOR
VI
VO
RL
S1
DUT
RT CL
open
001aad983
Test data is given in Table 12. Definitions test circuit: RT = Termination resistance should be equal to output impedance Zo of the pulse generator CL = Load capacitance including jig and probe capacitance RL = Load resistor S1 = Test selection switch
Fig 8. Load circuitry for switching times Table 12: Type 74HC244 74HCT244 Test data Input VI VCC 3V tr, tf 6 ns 6 ns Load CL 15 pF, 50 pF 15 pF, 50 pF RL 1 k 1 k S1 position tPHL, tPLH open open tPZH, tPHZ GND GND tPZL, tPLZ VCC VCC
74HC_HCT244_3
(c) Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 -- 22 December 2005
14 of 22
Philips Semiconductors
74HC244; 74HCT244
Octal buffer/line driver; 3-state
13. Package outline
DIP20: plastic dual in-line package; 20 leads (300 mil) SOT146-1
D seating plane
ME
A2
A
L
A1
c Z e b1 b 20 11 MH wM (e 1)
pin 1 index E
1
10
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.02 A2 max. 3.2 0.13 b 1.73 1.30 0.068 0.051 b1 0.53 0.38 0.021 0.015 c 0.36 0.23 0.014 0.009 D
(1)
E
(1)
e 2.54 0.1
e1 7.62 0.3
L 3.60 3.05 0.14 0.12
ME 8.25 7.80 0.32 0.31
MH 10.0 8.3 0.39 0.33
w 0.254 0.01
Z (1) max. 2 0.078
26.92 26.54 1.060 1.045
6.40 6.22 0.25 0.24
Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION SOT146-1 REFERENCES IEC JEDEC MS-001 JEITA SC-603 EUROPEAN PROJECTION
ISSUE DATE 99-12-27 03-02-13
Fig 9. Package outline SOT146-1 (DIP20)
74HC_HCT244_3 (c) Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 -- 22 December 2005
15 of 22
Philips Semiconductors
74HC244; 74HCT244
Octal buffer/line driver; 3-state
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
D
E
A X
c y HE vMA
Z 20 11
Q A2 A1 pin 1 index Lp L 1 e bp 10 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.1 A1 0.3 0.1 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 13.0 12.6 0.51 0.49 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.05 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 Z
(1)
0.9 0.4
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.055 0.394 0.016
0.035 0.004 0.016
8 o 0
o
Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. OUTLINE VERSION SOT163-1 REFERENCES IEC 075E04 JEDEC MS-013 JEITA EUROPEAN PROJECTION
ISSUE DATE 99-12-27 03-02-19
Fig 10. Package outline SOT163-1 (SO20)
74HC_HCT244_3 (c) Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 -- 22 December 2005
16 of 22
Philips Semiconductors
74HC244; 74HCT244
Octal buffer/line driver; 3-state
SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm
SOT339-1
D
E
A X
c y HE vMA
Z 20 11
Q A2 pin 1 index A1 (A 3) Lp L 1 e bp 10 wM detail X A
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 2 A1 0.21 0.05 A2 1.80 1.65 A3 0.25 bp 0.38 0.25 c 0.20 0.09 D (1) 7.4 7.0 E (1) 5.4 5.2 e 0.65 HE 7.9 7.6 L 1.25 Lp 1.03 0.63 Q 0.9 0.7 v 0.2 w 0.13 y 0.1 Z (1) 0.9 0.5 8 o 0
o
Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included. OUTLINE VERSION SOT339-1 REFERENCES IEC JEDEC MO-150 JEITA EUROPEAN PROJECTION
ISSUE DATE 99-12-27 03-02-19
Fig 11. Package outline SOT339-1 (SSOP20)
74HC_HCT244_3 (c) Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 -- 22 December 2005
17 of 22
Philips Semiconductors
74HC244; 74HCT244
Octal buffer/line driver; 3-state
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
SOT360-1
D
E
A
X
c y HE vMA
Z
20
11
Q A2 pin 1 index A1 (A 3) A
Lp L
1
e bp
10
wM detail X
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.1 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.30 0.19 c 0.2 0.1 D (1) 6.6 6.4 E (2) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1 Lp 0.75 0.50 Q 0.4 0.3 v 0.2 w 0.13 y 0.1 Z (1) 0.5 0.2 8 o 0
o
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT360-1 REFERENCES IEC JEDEC MO-153 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19
Fig 12. Package outline SOT360-1 (TSSOP20)
74HC_HCT244_3 (c) Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 -- 22 December 2005
18 of 22
Philips Semiconductors
74HC244; 74HCT244
Octal buffer/line driver; 3-state
DHVQFN20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; SOT764-1 20 terminals; body 2.5 x 4.5 x 0.85 mm
D
B
A
A A1 E c
terminal 1 index area
detail X
terminal 1 index area e 2 L
e1 b 9 vMCAB wM C y1 C
C y
1 Eh 20
10 e 11
19 Dh 0
12 X 2.5 scale 5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A(1) max. 1 A1 0.05 0.00 b 0.30 0.18 c 0.2 D (1) 4.6 4.4 Dh 3.15 2.85 E (1) 2.6 2.4 Eh 1.15 0.85 e 0.5 e1 3.5 L 0.5 0.3 v 0.1 w 0.05 y 0.05 y1 0.1
Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. OUTLINE VERSION SOT764-1 REFERENCES IEC --JEDEC MO-241 JEITA --EUROPEAN PROJECTION ISSUE DATE 02-10-17 03-01-27
Fig 13. Package outline SOT764-1 (DHVQFN20)
74HC_HCT244_3 (c) Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 -- 22 December 2005
19 of 22
Philips Semiconductors
74HC244; 74HCT244
Octal buffer/line driver; 3-state
14. Abbreviations
Table 13: Acronym CMOS DUT ESD HBM LSTTL MM Abbreviations Description Complementary Metal Oxide Semiconductor Device Under Test ElectroStatic Discharge Human Body Model Low-power Schottky Transistor-Transistor Logic Machine Model
15. Revision history
Table 14: Revision history Release date 20051222 Data sheet status Product data sheet Change notice Doc. number Supersedes 74HC_HCT244_CNV _2 Document ID 74HC_HCT244_3 Modifications:
* * *
The format of this data sheet has been redesigned to comply with the new presentation and information standard of Philips Semiconductors. Section 4 "Ordering information", Section 6 "Pinning information" and Section 13 "Package outline": Added DHVQFN package information Section 10 "Static characteristics": Added from the family specification Product specification -
74HC_HCT244_CNV_2
19901201
74HC_HCT244_3
(c) Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 -- 22 December 2005
20 of 22
Philips Semiconductors
74HC244; 74HCT244
Octal buffer/line driver; 3-state
16. Data sheet status
Level I II Data sheet status [1] Objective data Preliminary data Product status [2] [3] Development Qualification Definition This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
III
Product data
Production
[1] [2] [3]
Please consult the most recently issued data sheet before initiating or completing a design. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
17. Definitions
Short-form specification -- The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition -- Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information -- Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes -- Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
19. Trademarks
Notice -- All referenced brands, product names, service names and trademarks are the property of their respective owners.
18. Disclaimers
Life support -- These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors
20. Contact information
For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
74HC_HCT244_3
(c) Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 -- 22 December 2005
21 of 22
Philips Semiconductors
74HC244; 74HCT244
Octal buffer/line driver; 3-state
21. Contents
1 2 3 4 5 6 6.1 6.2 7 7.1 8 9 10 11 12 13 14 15 16 17 18 19 20 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 5 Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5 Recommended operating conditions. . . . . . . . 6 Static characteristics. . . . . . . . . . . . . . . . . . . . . 6 Dynamic characteristics . . . . . . . . . . . . . . . . . 10 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 20 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 21 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Contact information . . . . . . . . . . . . . . . . . . . . 21
(c) Koninklijke Philips Electronics N.V. 2005
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 22 December 2005 Document number: 74HC_HCT244_3
Published in The Netherlands

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